Shop
Non-abrasive polishing film! Cleaning Tape
This is a tape specialized for cleaning without scratching the substrate with ultra-precisely arranged abrasives using our coating technology. It is possible to remove residual foreign matter from the pre-process or from the environment without scratching the substrate.
Polishing tape is made in a clean room with nano-level abrasives.
Effectively removes foreign matter and abnormal protrusions on the hard disk substrate to achieve magnetic head levitation characteristics.
Mipox coating technology makes it possible to control the surface condition of the tape to provide a wide variety of characteristics.
Slit technology provides a high quality finish on the tape edge surface and prevents foreign matter from falling out.
＊In the burnishing (final polishing) process of hard disk manufacturing; as of January 2025, according to our own research.
This abrasive paper is designed to ensure a uniform, high-quality finish. It is easy to use, so it can be used by beginners and professionals alike. In addition, it has excellent abrasive power and durability, making it suitable for long hours of work and can be used in harsh environments. Its versatility makes it effective in any work environment.
Our Cleaning Sheets have a large lineup to meet all needs.
In the wafer inspection process of semiconductor front-end processing, it is important to maintain the cleanliness and shape of dedicated testers at a constant level in order to reduce the risk of defective wafers. In the worst case, the accuracy of the wafer inspection process can deteriorate to the point where wafer inspection must be interrupted or the dedicated tester replaced for an extended period of time. Mipox cleaning sheets are effective in cleaning and shaping these dedicated testers.
The optimal solution for polishing to meet diverse needs
SC/AO polishing films for optical fiber applications were developed primarily for resin removal and end face polishing for single-core and multi-core fibers.
For single cores, it is mainly used for resin removal and for multi-cores, it is used for resin removal and flat polishing.